2 - Manufacturing of printed wiring boards

The laminator machine covers the board surfaces with dry photoresist film. Both side of the shipped film is covered with polymer foil, which provides protection against damages. One of this foil will be removed by the machine during the laminating process, the second one will be removed later, before exposing. The machine generates heat, which is necessary for optimal adhesion of the photoresist.

The laminated board has to be exposed through a film that contains the positive pattern. The exposure unit has two frames, which go alternately into the exposing space. The equipment has light intensity meter, with exposure control unit, which set correct exposure, and control shutter system. The light sources are UV lamps.

The developing process has the goal to remove the unpolymerised part of the photosensitive soldermask from the board. The developer contains a conveyor and a spraying system.