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5 - Thick-film technology

5.2 - Insulating substrates, passive networks, HDI interconnects

MLC (Multilayer Ceramic):
  1. ceramic base material, mainly (Al2O3)
  2. the technology comes from the ceramic packaging technology
  3. firing at very high temperature, above the ceramics (sintering temperature >1500 C)
  4. called HTCC (High Temperature Cofired Ceramic)
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      MLGC (MultiLayer Glass Ceramic):
      1. glass-ceramic base material
      2. the technology comes from the simple ceramic thick film technology and is therefore compatible with it
      3. firing at lower temperature, as in the simple ceramic thick film technology ~800 - 900C
      4. buried passive elements (R, L, C) can be prepared
      5. called LTCC (Low Temperature Cofired Ceramic)
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      In insulating substrate IC-s, the jól üen
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