The course introduces students to modern manufacturing, with the main focus to design for manufacturing. Design plays a critical role in the success or failure of manufacturing and assembling. The course exposes students to integration of engineering design activities oriented to manufacturing and volume production. Labs are integral parts of the course, and expose students to various practical design and manufacturing issues and problems. This course provides students with the opportunity to develop and demonstrate an understanding of product design and manufacturing processes fundamentals, offering design for manufacturing and assembling techniques, which are used to minimize product cost through design and process improvements. Computer aided design (CAD) and computer aided manufacturing (CAM) principles are introduced in the development of microsystems and modules. This part will introduce students to the use of modern production methods, including printed circuit board (PCB) layout and computer numerical control (CNC) drilling and milling. It will also enable students to experience the full cycle of design, manufacture and testing of microsystems and modules. Additionally, students will execute a practical project, while obtaining feedback from industry concerning the introduction in production. Finally, attendees will have a unique opportunity to obtain first-hand information on design issues that impact both manufacturability and testability.

The course introduces students to modern electronic packaging and assembling technologies of microsystems and modules. It exposes students the fundamentals of microsystems packaging and assembling technologies, packaging materials, current assembling technologies, basics of nanopackaging and packaging technologies trends. Labs are integral parts of the course, and expose students to various practical manufacturing and assembling issues/problems found in industry. This course provides students with the opportunity to develop and demonstrate an understanding of manufacturing processes, techniques and technologies which are used to optimise the development of microsystems/modules. It will also enable students to experience the full cycle of manufacturing and testing of electronic products. Additionally, each student will manufacture a small complexity electronic module, receiving permanently real feedback from various industrial partners.

The course “Technology of Electronics Products” provides knowledge and practical skills for students related to circuit modules and systems. The students will be able to analyse and classify microelectronic components and substrates, as well as, electronics, mechatronics, optoelectronic and other modules. The student will know the construction of electronic appliances including their manufacturing, assembly and maintenance technologies. The course provides a comprehensive overview of microelectronic devices, components, mechatronic, optoelectronic and other modules and about the structure of electronic equipment including their manufacturing, and assembly technologies.

The objective of the course is to deepen the knowledge of students in the field of assembly and inspection technologies of electronics products based on the course of “Technology of electronics products”. The course deals with the steps of reflow soldering technology in details. Stencil manufacturing technologies, stencil design guidelines have also been included. In the aspect of automated soldering, heat transportation method for reflow soldering, thermal profiling for reflow- and wave soldering, and troubleshooting for reflow- and wave soldering failures are discussed. Lastly, insight into inspection techniques (AOI – automated optical inspection, X-ray inspection) and into test techniques (ICT – in-circuit test and FP – flying probe test) is given.

The objective of the course “Virtual Laboratory Support for Microelectronics Packaging Education” is to provide an overview about the content and usage of a virtual laboratory focusing on microelectronics packaging. The virtual laboratory includes brief descriptions about the basic principles of different packaging technologies, about the equipment and manufacturing machines related to the packaging technologies, and also animations about the principles of manufacturing processes and about the operation of manufacturing machines. The virtual laboratory covers the following areas of microelectronics packaging: manufacturing of printed wiring boards; assembly of electronic circuits – soldering technologies; nanometrology, sensors & microfluidics technology; thin-film and thick-film technologies; laser technologies; failure analysis.

The course module provides theoretical and practical information for design, production and application of sensors and Micro Electro-Mechanical System (MEMS) in the practice. After a short introduction with a summary of the basic definitions, the brief overview of the fundamental areas are presented, namely: sensor technologies, transducer structures, and operation principles of various structures for sensors; technologies, mechanical structures, and operation principles of various structures for MEMS devices. Then various sensor types and applications of various MEMS types are described, where recent developments in structures, application possibilities and applied materials are also discussed.

The course provides the participants with an overview of sensors and MEMS devices, i.e. miniature devices for measuring physical and chemical quantities such as pressure, acceleration, speed chemical concentration, etc. Sensors and MEMS devices fabricated by solid-state and MEMS technology, from ceramics, thin and thick films, polymer films, as well as, by optical fibre technology are described and characterized. The different sensor and MEMS structures, the principles of sensing various parameters, and sensing effects are presented. The overview of application fields includes industrial process control, automotive and household case studies, with a special focus on environmental monitoring and biomedical applications. Advances in sensor packaging, modelling, design and fabrication are also described shortly.

Silicon Homojunction is the main available technology for the production of solar cells. To understand how it is possible to obtain the best quality / price ratio, it is first necessary to explain the principle and the fundamentals of the electric current generation. The industrial fabrication process is then detailed, covering each step and each component of the solar cell. The limitations in the efficiency are then presented, and several advanced technologies aiming at improving the efficiency are also compared. The market perspective is finally discussed to insist on the prominence of the silicon homojunction technology.

The importance of maintenance of electronics devices integratated in Renewable energy systems is increasing nowadays. Renewable energy systems use an important variety of electronics devices such as grid-connected and standing alone PV inverters, battery charge controllers, on-grid chargers, rectifiers, solar thermal controllers… In this course, professionals specialized in maintenance will find technical updating of renewable energy systems. They will be able to define a maintenance plan and its monitoring work. During the course, practical cases based in real breakdowns of Renewable energy electronics devices will be offered. Then, the student will identify the breakdown and will be able to make a correct diagnosis by using both the required competences and measurement devices commonly used in this sector.

Integrated circuits (ICs) often play an important role in the electromagnetic compatibility (EMC) of embedded systems. Electromagnetic (EM) compliance has traditionally been focused on systems, cables, shielding and protections at printed circuit board level. However, ICs are the ultimate source of noise that produce interference, as well as ultimate victims of electromagnetic interference. Of all the components in a typical electronic system, ICs tend to be the most susceptible to damage caused by over-voltage or over-current conditions. The course aims at presenting the industrial context of EMC, highlighting the importance of EM-friendly integrated circuits which ensure reliable and safe electronic applications. It also aims at providing minimum skills to students, researchers and engineers to take into account EMC at early stages of electronic product design. This course provides a unique collection of information, both theoretical and practical, focused on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, interface ports, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from various cooperative research projects with industry are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are also proposed, with prospective vision about the technology scale down and trends towards 3D integration.

A companion tool IC-EMC is used for illustration of the course concepts through a set of simulation trainings covering several aspects of EMC of ICS, including conducted and radiated emission, passive network modelling, noise source and high-speed switch modelling, and susceptibility of devices to conducted interference.

INSA Toulouse has developped a course focused on nano-CMOS cell design with practical training based on Microwind educational tool. The course is provided for initial education. Basic logic cells such as inverters, nand, nor, xor, memories such as RD, D-Reg, 6-transistor RAM are covered, with performance simulation. Analog cells are also introduced (OpAmp, converters) with trade-off between power, precision, manufacturability and robustness to process variations. New topics such as FinFET (14-nm and below) & 3D-ICs, link to IBIS for multi-gigabit input/output interfacing is being developed as part of MECA project.

The downscaling of sensing devices is giving several improvements in terms of sensor efficiency, detection limit and is opening the possibility of doing analysis at molecular level. A review of the most important solutions at the state of the art will be done then a specific research area will be put under analysis. With this goal one of the most promising structures, the nanogaps, will be studied. With nanogaps it is possible to analyse molecules at nanometric scale. Following these aims, the course will cover the basic concepts of nanoscale sensing and a practical example of nanogap production will be carried out, starting from the fabrication in a cleanroom of the structures where the nanogaps can be created, up to the study of the system useful to produce the nanogaps.

The study of ultra-deep-sub-micron effects on Ultra-Large-System-Integration circuits is the focus of the course. The approach is a learning by doing one and is based on the help of a novel and OpenSource tool developed specifically for this purpose and WEB based. The tool (TAMTAMS) is based on up-to-date compact models of ultra-deep submicron effects on devices and interconnections, and includes models of system level performance (power dissipation, frequency, area, skew, noise rejection, sensitivity to process variation, ...). TAMTAMS quantitatively predicts the effects on integrated systems due to technology choices and issues. The technologies used are not only the CMOS based ones from 90 nm downto 20 nm, but also the beyond CMOS ones (e.g. SET, CNFET, MOFET, CNT Wires, …), and a comparison between the two sets in terms of performance is achieved as a final result.

Objectives of the module are to teach interdisciplinary communicative skills, methods and tools which will enable the audience of this course to fulfil their current and future tasks superiorly. The module includes the following topics: leadership skills; situational leadership; communication/ platform skills; conversation techniques; presentation techniques; transformational versus transactional leadership theory, emergence of conflicts; conflict management; types of conflicts; conflict progression; conflict resolution; communicating with groups; etiquette (guide) and career.

"A project manager must lead his team in performing various project activities". The module includes the following topics: work breakdown; milestones; work packages; coordination; software tools for management; project monitoring and controlling; monitoring and controlling tasks; project delivery system; critical chain project management.

The objectives of the module are to teach the basics of thin-film technologies and of superconductive materials. The module includes the following topics: Overview of the film fabrication techniques; overview of some important instrumental analytics for thin films; superconductive wires, photovoltaics; new concepts and materials in energy saving technologies.

“Soft skills” as a term in the world of work are associated with a person´s emotional intelligence, the cluster of personality traits, social graces, communication, language proficiency, personal habits, feelings, optimism and teamwork that characterize relationships with other people. Though soft skills are hard to quantify or measure, they are needed for everyday life as well as for work.

In the present course, six of the main areas relevant to the soft skills field are covered in the lessons named: Interpersonal Communicative Skills; Time Management Skills; Problem Solving Skills; Managerial Skills; Report Writing Skills; Presentation Skills. The aim of the course is to help develop interpersonal communicative skills based on life skills, to design individual plans of effective time management, to prepare the course participants to effectively solve problems and perform roles of managers by using empathic components and critical thinking, and to improve their ability to create professionally written reports and oral presentations.

Besides the lectures containing basic information on the stated skills, a practical part is also included providing space for discussions and practising the acquired knowledge by completing tasks and exercises relevant to the given topics.

The above mentioned contact lessons (both lectures and practical seminars) are supported by course participants´ individual work during which they will complete the tasks given by a lecturer after finishing each theme of the course.

This course will take an in-depth look at nanomaterials used in nanoelectronics. Theory and concepts of nanomaterials will be covered, including the chemistry and physics of nanomaterials. The course will also focus on major classes of nanomaterials, including carbon nanotubes, nanostructured materials, nanowires, nanoparticles, nanoclays, and other nanomaterials. Applications of nanomaterials to technology areas in nanoelectronics will also be discussed.

Problems related to the design and investigation of submicron and nanoscale MOS integrated circuits are covered by this course. Currently there are some nanotechnologies in the means of 14 nm design kits, which are available via the EUROPRACTICE organization. The main attention is drawn to the theoretical and practical usage of state-of-the-art industrial CAD systems, e.g. CADENCE, SYNOPSYS and others. The designers who use those systems can implement nanoscale elements from the relevant standard cell libraries. The specific parameters, related to the nanoscale effects are represented in the embedded system models of the elements.

The ever expanding field of MEMS is an interdisciplinary one. Working with different types of MEMS sensors and actuators and understanding the physical concepts and characteristics that their functioning is based on, is of utmost importance. Furthermore, like macro systems, MEMS also operate in closed loop control systems, where the need for precise control and guidance is essential. Based on this notion, this course aims at educating the students about the basics of MEMS sensor and actuator functioning, and of the methods and techniques of designing suitable control laws for MEMS. All this will be supported by practical laboratory examples and case studies in order to provide students with hands-on experience and practice.

As semiconductor feature sizes shrink into the nanometer scale regime, even conventional device behaviour becomes increasingly complicated as new physical phenomena at short dimensions occur, and limitations in material properties are reached. In addition to the problems related to the understanding of actual operation of ultra-small devices, the reduced feature sizes require more complicated and time-consuming manufacturing processes. This fact signifies that a pure trial-and-error approach to device optimization will become impossible since it is both too time consuming and too expensive. Since computers are considerably cheaper resources, simulation is becoming an indispensable tool for the device engineer. Besides offering the possibility to test hypothetical devices which have not (or could not) yet been manufactured, simulation offers unique insight into device behavior by allowing the observation of phenomena that cannot be measured on real devices. Device simulation can be thought of as one component of technology for computer-aided design (TCAD), which provides a basis for device modeling, which deals with compact behavioral models for devices and sub-circuits relevant for circuit simulation in commercial packages.

This course aims to learn students about physically based device modeling with the emphasis on different semi-classical simulation methods needed for modeling micro and nanoscale semiconductor devices. All this will be supported by practical examples in order to provide students with hands-on experience and practice.

Microelectronics deals with the miniaturization of electronics components, and its evolution has given rise to many modern benefits. Its progress level directly affects the development of the information technology. Microelectronics involves the design, fabrication and testing of integrated circuits. Integrated circuits are widely used in computers, telecommunication equipment and electronics devices for information acquisition, transmission, storage and processing information. This course address the technology for production of integrated circuits and methods for the design of digital integrated circuits.

Microelectronics deals with the miniaturization of electronics components, and its evolution has given rise to many modern benefits. Its progress level directly affects the development of the information technology. Microelectronics involves the design, fabrication and testing of integrated circuits. Integrated circuits are widely used in computers, telecommunication equipment and electronics devices for information acquisition, transmission, storage and processing information. This course address the fundamentals of microelectronics and fundamental processes in microelectronics technology for the production of integrated circuits.

Objective of this course is to contribute in bridging the gap between education in microsystems and needs of the business. Essential topics extracted from the development and prototyping of microsystems with piezoresistive feedback are presented to the learners. The students will be introduced to fundamentals of microsystems; facilities, technologies for prototyping and design of piezoresistive microsystems with embedded flexures, and some advanced applications of self-sensing microdevices. The synergy between material science, exploited technologies and design of application-specific microsystems is demonstrated. Knowledge and capacity of the learners are evaluated by a test and monitoring of participation in application-specific design project.

In this Video Course Course Astel presents the main criticisms in handling semiconductor devices manufacturing. The design of an optical inspection station of semiconductor wafers is presented. The topics covered are: what a wafer is; critical wafer handling; how can we handle wafers? DORINA: main control board (Device ORIented New Assy)